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Printed page 64. PDF page 97.
Continuity failures (resistance values above the CMM threshold) were located at the solder joint interface between the J2 flex circuit and the header pin; y Continuity failures (resistance values above the CMM threshold) were intermittent; and y The solder microstructuOpen official document at PDF page 97ASC-AOR-16-06-001: TransAsia Airways Flight GE235
Printed page 65. PDF page 98.
Continuity failures (resistance values above the CMM threshold) were located at the solder joint interface between the J2 flex circuit and the header pin; y The solder microstructure was consistent with enlargement, coarsening and cracking in a stress zone adjacentOpen official document at PDF page 98ASC-AOR-16-06-001: TransAsia Airways Flight GE235