Search report text, read a short matching passage, then open the source page.
Exact phrases match first; otherwise all words must occur close together. Six excerpts maximum. Text extraction cannot search image-only charts. Warsaw uses a report transcription with missing figures and appendices.
3 matching PDF pages. Showing 3 short source excerpts. Open the document for full context.
Printed page 62. PDF page 95.
advanced on pins near the end of the strip. The solder microstructure was consistent with enlargement, coarsening and cracking in a stress zone adjacent to the pin/solder interface. Away from this “stress zone” the solder microstructure was very fine. FigureOpen official document at PDF page 95ASC-AOR-16-06-001: TransAsia Airways Flight GE235
Printed page 64. PDF page 97.
CMM threshold) were intermittent; and y The solder microstructure was consistent with enlargement, coarsening and cracking in a stress zone adjacent to the solder joint interface between the flex circuit and the header pin. AFU No. 3 Only J2 connectorOpen official document at PDF page 97ASC-AOR-16-06-001: TransAsia Airways Flight GE235
Printed page 65. PDF page 98.
advanced on pins near the end of the strip. The solder microstructure was consistent with enlargement, coarsening and cracking in a stress zone adjacent to the pin/solder interface. Away from this “stress zone” the solder microstructure was very fine. SummaryOpen official document at PDF page 98ASC-AOR-16-06-001: TransAsia Airways Flight GE235