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Printed page 62. PDF page 95.
the strip. The solder microstructure was consistent with enlargement, coarsening and cracking in a stress zone adjacent to the pin/solder interface. Away from this “stress zone” the solder microstructure was very fine. Figure 1.16-4 Microscope (40X magnification) and SEOpen official document at PDF page 95ASC-AOR-16-06-001: TransAsia Airways Flight GE235
Printed page 64. PDF page 97.
intermittent; and y The solder microstructure was consistent with enlargement, coarsening and cracking in a stress zone adjacent to the solder joint interface between the flex circuit and the header pin. AFU No. 3 Only J2 connector pin J failedOpen official document at PDF page 97ASC-AOR-16-06-001: TransAsia Airways Flight GE235
Printed page 65. PDF page 98.
the strip. The solder microstructure was consistent with enlargement, coarsening and cracking in a stress zone adjacent to the pin/solder interface. Away from this “stress zone” the solder microstructure was very fine. Summary of Findings for AFU No. 3 yOpen official document at PDF page 98ASC-AOR-16-06-001: TransAsia Airways Flight GE235